Libro Advanced Liquid Metal Cooling for Chip, Device and System De Liu, Jing

portada Advanced Liquid Metal Cooling for Chip, Device and System

Formato

Libro Físico

Autor

Jing Liu

Editorial

World Scientific Publishing Company

Idioma

Inglés

N° páginas

960

Encuadernación

Tapa Dura

Dimensiones

22.9 x 15.2 x 5.1 cm

Peso

1.44 kg.

ISBN13

9789811245855

Categorías

Ingeniería aplicada de materiales electrónicos, magnéticos y ópticos

Advanced Liquid Metal Cooling for Chip, Device and System

Jing Liu (Autor) · World Scientific Publishing Company · Tapa Dura

Sin Stock

Reseña del libro "Advanced Liquid Metal Cooling for Chip, Device and System"

This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category -- liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system.With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.