Compartir
First International Congress on Adhesion Science and Technology---Invited Papers: Festschrift in Honor of Dr. K.L. Mittal on the Occasion of His 50th (en Inglés)
Van Ooij, W. J. ; Anderson Jnr, H. R. (Autor)
·
CRC Press
· Tapa Dura
First International Congress on Adhesion Science and Technology---Invited Papers: Festschrift in Honor of Dr. K.L. Mittal on the Occasion of His 50th (en Inglés) - Van Ooij, W. J. ; Anderson Jnr, H. R.
$ 154.680
$ 309.350
Ahorras: $ 154.670
Elige la lista en la que quieres agregar tu producto o crea una nueva lista
✓ Producto agregado correctamente a la lista de deseos.
Ir a Mis Listas
Origen: Reino Unido
(Costos de importación incluídos en el precio)
Se enviará desde nuestra bodega entre el
Lunes 10 de Junio y el
Jueves 20 de Junio.
Lo recibirás en cualquier lugar de Chile entre 1 y 3 días hábiles luego del envío.
Reseña del libro "First International Congress on Adhesion Science and Technology---Invited Papers: Festschrift in Honor of Dr. K.L. Mittal on the Occasion of His 50th (en Inglés)"
This Festschrift documents the Proceedings of the First International Congress on Adhesion Science and Technology, held in honor of Dr. Kash Mittal on the occasion of his 50 birthday, in Amsterdam, The Netherlands, October 16-20, 1995. It contains the full accounts of the plenary and invited lectures, which are divided into the following seven parts: Part 1: Fundamental aspects of adhesion and general topics; Part 2: Contact angle, wettability and surface energetics; Part 3: Surface modification: Relevance to adhesion; Part 4: Adhesives and adhesive joints; Part 5: Adhesion aspects of polymeric coatings, and polymer-polymer interphase; Part 6: Metal-polymer and metal-ceramic adhesion; and Part 7: General papers. The topics covered include many different aspects of adhesion science and technology, and both fundamental and applied issues are addressed. The final section of this volume gives a listing of titles, authors and affiliations of the other 185 papers which were included in the technical program of the conference.
