Name: Guidebook for Managing Silicon Chip Reliability (Electronic Packaging) (en Inglés)
Price: 76940.00 CLP
Availability: InStock
Author: Riko Radojcic; Gopal Rao; Michael Pecht
ISBN: 9780367400064

portada Guidebook for Managing Silicon Chip Reliability (Electronic Packaging) (en Inglés)

Guidebook for Managing Silicon Chip Reliability (Electronic Packaging) (en Inglés)

Formato

Libro Físico

Editorial

Crc Pr Inc

Autor

Riko Radojcic; Gopal Rao; Michael Pecht

Idioma

Inglés

Encuadernación

Tapa Blanda

ISBN13

9780367400064

Guidebook for Managing Silicon Chip Reliability (Electronic Packaging) (en Inglés)

Riko Radojcic; Gopal Rao; Michael Pecht (Autor) · Crc Pr Inc · Tapa Blanda

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Reseña del libro "Guidebook for Managing Silicon Chip Reliability (Electronic Packaging) (en Inglés)"

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.