Name: Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design (en Inglés)
Price: 102110.00 CLP
Availability: InStock
Author: Sandip Bhattacharya (Editor) Ajayan J (Editor) Fernando Avila Herrera (Editor)
ISBN: 9781032363813

portada Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design (en Inglés)

Formato

Libro Físico

Editorial

Crc Press

Autor

Sandip Bhattacharya (Editor) Ajayan J (Editor) Fernando Avila Herrera (Editor)

Idioma

Inglés

N° páginas

222

Encuadernación

Tapa Dura

ISBN13

9781032363813

N° edición

Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design (en Inglés)

Sandip Bhattacharya (Editor) Ajayan J (Editor) Fernando Avila Herrera (Editor) (Autor) · Crc Press · Tapa Dura

Libro Nuevo

$ 102.110

$ 204.210

Ahorras: $ 102.100

50% descuento

Envío normal

Origen: Estados Unidos (Costos de importación incluídos en el precio)

Se enviará desde nuestra bodega entre el Miércoles 19 de Junio y el Miércoles 03 de Julio.

Lo recibirás en cualquier lugar de Chile entre 1 y 3 días hábiles luego del envío.

Reseña del libro "Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design (en Inglés)"

Aggressive scaling of device and interconnect dimensions has resulted in many low-dimensional issues in the nanometer regime. This book deals with various new-generation interconnect materials and interconnect modeling, and highlights the significance of novel nano-interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. Features: - Focuses on materials and nanomaterials utilization in next-generation interconnects based on carbon nanotubes (CNT) and graphene nanoribbons (GNR). - Helps readers realize interconnects, interconnect models, and crosstalk noise analysis. - Describes hybrid CNT- and GNR-based interconnects. - Presents the details of power supply voltage drop analysis in CNT and GNR interconnects. - Overviews pertinent RF performance and stability analysis. This book is aimed at graduate students and researchers in electrical and materials engineering, and nano-/microelectronics.