Name: Rf and Microwave Module Level Design and Integration (Materials, Circuits and Devices) (en Inglés)
Price: 178360.00 CLP
Availability: InStock
Author: Mohammad Almalkawi
ISBN: 9781785613593

portada Rf and Microwave Module Level Design and Integration (Materials, Circuits and Devices) (en Inglés)

Formato

Libro Físico

Editorial

The Institution Of Engineering And Technology

Autor

Mohammad Almalkawi

Año

2019

Idioma

Inglés

N° páginas

336

Encuadernación

Tapa Dura

ISBN13

9781785613593

Categorías

Ingeniería electrónica

Rf and Microwave Module Level Design and Integration (Materials, Circuits and Devices) (en Inglés)

Mohammad Almalkawi (Autor) · The Institution Of Engineering And Technology · Tapa Dura

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Reseña del libro "Rf and Microwave Module Level Design and Integration (Materials, Circuits and Devices) (en Inglés)"

RF and Microwave Module Level Design and Integration presents a thorough introduction to the basic elements of radio frequency (RF) and microwave modules, followed by a discussion of system-level concepts and measures that can be applied to real-world designs. With a strong emphasis on design and integration, the book offers practical solutions to today's commonly encountered challenges in RF and microwave modules, including system integration, network loss reduction techniques, electromagnetic compatibility, crosstalk reduction techniques, computer-aided design tools, system-level modeling methodologies, and system-level performance evaluation via common RF measurements. Several design examples are presented across the book chapters. This book describes techniques for the design and development of today's complex (multi-chip) radio frequency and microwave modules for an audience of engineers in academia and industry, and advanced students focusing on RF and microwave module design and integration.