Name: System Level Esd Protection (en Inglés)
Price: 124840.00 CLP
Availability: InStock
Author: Vashchenko, Vladislav ; Scholz, Mirko
ISBN: 9783319348926

portada System Level Esd Protection (en Inglés)

Formato

Libro Físico

Autor

Vladislav Vashchenko

Mirko Scholz

Editorial

Springer

Idioma

Inglés

N° páginas

320

Encuadernación

Tapa Blanda

Dimensiones

23.4 x 15.6 x 1.8 cm

Peso

0.48 kg.

ISBN13

9783319348926

Categorías

Electrónica: circuitos y componentes

System Level Esd Protection (en Inglés)

Vladislav Vashchenko (Autor) · Mirko Scholz (Autor) · Springer · Tapa Blanda

Libro Físico

$ 124.840

$ 249.670

Ahorras: $ 124.830

50% descuento

Envío normal

Origen: Estados Unidos (Costos de importación incluídos en el precio)

Se enviará desde nuestra bodega entre el Viernes 14 de Junio y el Viernes 21 de Junio.

Lo recibirás en cualquier lugar de Chile entre 1 y 3 días hábiles luego del envío.

Reseña del libro "System Level Esd Protection (en Inglés)"

This book addresses key aspects of analog integrated circuits and systems design related to system level electrostatic discharge (ESD) protection. It is an invaluable reference for anyone developing systems-on-chip (SoC) and systems-on-package (SoP), integrated with system-level ESD protection. The book focuses on both the design of semiconductor integrated circuit (IC) components with embedded, on-chip system level protection and IC-system co-design. The readers will be enabled to bring the system level ESD protection solutions to the level of integrated circuits, thereby reducing or completely eliminating the need for additional, discrete components on the printed circuit board (PCB) and meeting system-level ESD requirements. The authors take a systematic approach, based on IC-system ESD protection co-design. A detailed description of the available IC-level ESD testing methods is provided, together with a discussion of the correlation between IC-level and system-level ESD testing methods. The IC-level ESD protection design is demonstrated with representative case studies which are analyzed with various numerical simulations and ESD testing. The overall methodology for IC-system ESD co-design is presented as a step-by-step procedure that involves both ESD testing and numerical simulations.