Area Array Packaging Processes (en Inglés)

Ken Gilleo · Mcgraw-Hill

Ver Precio
Envío a todo Chile

Reseña del libro

This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.

Opiniones del Libro

Opiniones sobre Buscalibre

Ver más opiniones de clientes