Name: Handbook of Silicon Based Mems Materials and Technologies (Micro & Nano Technologies) (Micro and Nano Technologies) (en Inglés)
SKU: 56731078
Price: 270370.00 CLP
Availability: InStock
Author: Markku Tilli Mervi Paulasto-Krockel Teruaki Motooka Professor Veikko Lindroos Veikko Lindroos Professor

portada Handbook of Silicon Based Mems Materials and Technologies (Micro & Nano Technologies) (Micro and Nano Technologies) (en Inglés)

Handbook of Silicon Based Mems Materials and Technologies (Micro & Nano Technologies) (Micro and Nano Technologies) (en Inglés)

Formato

Libro Físico

Editorial

William Andrew 2015-11-02,

Autor

Markku Tilli Mervi Paulasto-Krockel Teruaki Motooka Professor Veikko Lindroos Veikko Lindroos Professor

Idioma

Inglés

Encuadernación

Tapa Dura

ISBN13

9780323299657

N° edición

0002

Handbook of Silicon Based Mems Materials and Technologies (Micro & Nano Technologies) (Micro and Nano Technologies) (en Inglés)

Markku Tilli Mervi Paulasto-Krockel Teruaki Motooka Professor Veikko Lindroos Veikko Lindroos Professor (Autor) · William Andrew 2015-11-02, · Tapa Dura

Libro Nuevo Importado

Envío: 17 a 22 días háb.

$ 491.580$ 270.370

-45%

Costos de importación incluídos en el precio ✅

Libro Nuevo

Quedan 100 unidades

$ 270.370

Llega entre el 24 Sep y el 01 Oct a Santiago, Región Metropolitana. Seleccionar ubicación

Agregar a lista de deseos

Reseña del libro "Handbook of Silicon Based Mems Materials and Technologies (Micro & Nano Technologies) (Micro and Nano Technologies) (en Inglés)"

The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.