Name: Handbook of Silicon Based Mems Materials and Technologies (Micro & Nano Technologies) (en Inglés)
SKU: 53317503
Price: 315760.00 CLP
Availability: InStock
ISBN: 9780128177860

portada Handbook of Silicon Based Mems Materials and Technologies (Micro & Nano Technologies) (en Inglés)

Handbook of Silicon Based Mems Materials and Technologies (Micro & Nano Technologies) (en Inglés)

Formato

Libro Físico

Editorial

Elsevier

Año

2020

Idioma

Inglés

N° páginas

1026

Encuadernación

Tapa Blanda

ISBN13

9780128177860

N° edición

Categorías

Ciencia de materiales

Handbook of Silicon Based Mems Materials and Technologies (Micro & Nano Technologies) (en Inglés)

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Reseña del libro "Handbook of Silicon Based Mems Materials and Technologies (Micro & Nano Technologies) (en Inglés)"

Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors