Name: High-Frequency Characterization of Electronic Packaging (en Inglés)
Price: 99600.00 CLP
Availability: InStock
Author: Martens, Luc
ISBN: 9781461375739

portada High-Frequency Characterization of Electronic Packaging (en Inglés)

High-Frequency Characterization of Electronic Packaging (en Inglés)

Formato

Libro Físico

Autor

Luc Martens

Editorial

Springer

Idioma

Inglés

N° páginas

158

Encuadernación

Tapa Blanda

Dimensiones

23.4 x 15.6 x 1.0 cm

Peso

0.26 kg.

ISBN13

9781461375739

Categorías

Ingeniería eléctrica
Robótica

High-Frequency Characterization of Electronic Packaging (en Inglés)

Luc Martens (Autor) · Springer · Tapa Blanda

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Reseña del libro "High-Frequency Characterization of Electronic Packaging (en Inglés)"

High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.