portada Thermal Management of Microelectronic Equipment Heat Transfer Theory Analysis Methods, and Design Practices, 2nd edition (en Inglés)

Thermal Management of Microelectronic Equipment Heat Transfer Theory Analysis Methods, and Design Practices, 2nd edition (en Inglés)

Formato

Libro Físico

Autor

Lian-Tuu Yeh

Editorial

American Society of Mechanical Engineers

Idioma

Inglés

N° páginas

524

Encuadernación

Tapa Dura

Dimensiones

22.9x15.2x2.9 cm

Peso

0.87 kg.

ISBN13

9780791861097

N° edición

0002

Categorías

Ingeniería mecánica
Ingeniería electrónica

Thermal Management of Microelectronic Equipment Heat Transfer Theory Analysis Methods, and Design Practices, 2nd edition (en Inglés)

Lian-Tuu Yeh (Autor) · American Society of Mechanical Engineers · Tapa Dura

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Reseña del libro "Thermal Management of Microelectronic Equipment Heat Transfer Theory Analysis Methods, and Design Practices, 2nd edition (en Inglés)"

This Second Edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advancements in the component technology of microelectronics. The most noticeable one is the addition of an entirely new chapter on microwave modules and the gallium arsenide (GaAs) chips, which have seldom been discussed in any of the textbooks or publications in the area of thermal management of electronic equipment. With this new chapter, the book is complete and whole in the area of thermal design of electronics systems. With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume.