Name: Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds (en Inglés)
Price: 43210.00 CLP
Availability: InStock
Author: Singh, Harjinder ; Sappal, Amandeep Singh ; Sharma, Manvinder
ISBN: 9786139858248

portada Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds (en Inglés)

Formato

Libro Físico

Autor

Harjinder Singh

Amandeep Singh Sappal

Manvinder Sharma

Editorial

LAP Lambert Academic Publishing

Idioma

Inglés

N° páginas

Encuadernación

Tapa Blanda

Dimensiones

22.9 x 15.2 x 0.4 cm

Peso

0.10 kg.

ISBN13

9786139858248

Categorías

Tecnología: cuestiones generales

Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds (en Inglés)

Harjinder Singh (Autor) · Amandeep Singh Sappal (Autor) · Manvinder Sharma (Autor) · LAP Lambert Academic Publishing · Tapa Blanda

Libro Físico

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$ 86.410

Ahorras: $ 43.200

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Origen: Estados Unidos (Costos de importación incluídos en el precio)

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Reseña del libro "Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds (en Inglés)"

Face to Face Stacking on Wafer to Wafer (WoW) can be done for the Cu-Cu direct bonding interconnects. A good mechanical strength to sustain shear force during thinning can be achieved by Cu bonding. While making reliable interconnect structures has been a persistent challenge. Stress results from material deposition, thermal expansion mismatch, and electromigration. Material deposition inevitably generates stress. Materials in interconnect structures, selected to function as conductors, dielectrics, or barriers, have dissimilar thermal expansion coefficients. The driving force comes from the stress built up due to grain growth and the thermal expansion mismatch (CTE) between Cu interconnect and dielectrics. The void space is then created in order to release the resulting stress. Also the electromigration phenomena caused due to current stressing and creates a void. So in this project, I worked on Stress Induced Voiding and Electromigration of Cu-Cu direct bonding sample with bonding temperature of 300C.